Min component: 01005
PCB size:350x330mm
Dimension:1000x1335x1627mm
weight:600kg
Koh Young KY8080 3D SPI
Specifications:
The KY-8030 is an in-line, fully automated SPI system that uses patented Koh Young shadow-free inspection technology and software to deliver 100% 3D inspection of solder paste.
• True patented 3D volume measurement
• No false calls – no escapes – no shadow problems
• Highest accuracy and repeatability
• No PCB color sensitivity
• Solder paste printing optimization - at its best
• Lower initial investment
• Low cost of ownership, fast ROI
• Shortest programming time
• Accurate, powerful SPC tool package
In-line SPI with no compromises KY-8030 is designed for manufacturers who need in-line SPI with no compromises in high precision and accuracy. With KY-8030, you buy the throughput capability that you need
KY-8030 is a process optimization tool built with world-class Koh Young quality components and engineering. It’s the perfect complement to your manufacturing line, where precise, accurate, repeatable results cannot be compromised. The KY-8030 is an in-line, fully automated SPI system that uses patented Koh Young shadow-free inspection technology and software to deliver 100% 3D inspection of solder paste. Superb Performance and Value in Automated 3D SPI
Medium-volume users will appreciate KY-8030’s rugged dependability and all the benefits of in-line 3D SPI but at a lower initial investment. It delivers superior value to the customer because it will out-perform costly competitive systems that don’t offer true 3D SPI.
Inspection Range | |
Metrology Capability | Volume, Area, Height, Offset, Bridging and Shape Deformity |
Types of Defects | Insufficient/Excessive/Missing Paste, Bridging, Shape Deformity and Paste Offset |
Measurement Principle | 3D Shadow Free Moiré |
Camera Technology | |
Camera | 2MPix |
XY Pixel Resolution: 20 µm 0.79 mils | |
Z Resolution: 0.37 µm 0.015 mils | |
Inspection Speed at 20 um | Shadow Free Mode:15.0 cm2/sec 2.33 sq. inch/sec |
High Speed Mode: 19.7 cm2/sec 3.05 sq. inch/sec | |
Volume Repeatability | < 1% at 3sigma (on a KY Calibration Target) |
< 3% at 3sigma (on a PCB) | |
Height Accuracy | 2mm |
Gage R&R | < 10 % at 6Sigma (± 50 tolerance) |
Max. PCB Warp | ± 3.5 mm |
Max. Paste Height | 400um 15.75 mils |
Min. Paste Deposit Size at 20um | Rectangle: 150um 5.91 mils |
Circle Min: 200um 7.87 mils | |
Distance between Paste Deposit | 100 mm (at 150 mm paste height) 3.94 mils (at 5.91 mils paste height) |
PCB Handling | |
Conveyor Width Adjustment | Automatic |
Conveyor Fix Type | Front/Rear Fixed (Factory Setting) |
Conveyor Height | 970 ~ 870 mm 38.19 ~ 34.25 inch |
System & Installation requirements | |
Supply | Electrical 200 ~ 240VAC, 50/60 Hz Single phase |
Air: 5 Kgf/cm2 | |
Operating System | Windows XP Professiona |
S/W | |
Statistical Analysis Tool | SPC Plus |
Inspection Program Generation | Import GERBER Data (274X, 274D) |
Options | Zoom Head (15, 20, 30 mm Autozoom) |
Off-line SPC & Defect Review Station | |
Off-line Programming Station ODB++ File Conversion | |
Barcode Reader (1D/2D) HDD Raid 1 (Mirrored) | |
Certified Calibration Target UPS | |
Above specifications are subject to change whithout notice. |
Keywords:
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Contact: Demi
Phone: +86 13632571161
E-mail: demi@flason.com
Add: No.94,Guangtian Road,Songgang Street,Bao an District Shenzhen China