Mounting Speed: 20,200CPH
PCB size:510 x 360 mm
Component range:0402 (01005)
JUKI KE2080 Pick and Place Machine
Specifications:
JUKI KE2080 Pick and Place Machine
he ultra-flexible KE-2080 can place a wide range of components from 0402 (01005) and ICs, to odd-form:
all at industry leading accuracy and speed.
Chip:
20,200CPH(laser centering/Optimum)(0.178Sec./chip)
16,700CPH(laser centering/IPC9850)
IC:
1,850CPH (vision centering / effective tact)
4,860CPH with MNVC option.
(510 x 360 mm) L-Wide substrate (510 x 360 mm) (optional) E Substrate (510 x 460 mm) *1
Component size: Laser recognition 0402 (English 01005) Chip ~ 33.5mm square element
Image recognition standard Camera: 3mm square element * 2 ~ 74mm square or 50 × 150mm
high resolution camera (optional): 1.0 × 0.5mm * 3 ~ 48mm square element or 24 × 72mm
Component Mounting speed: Chip components Best conditions: 0.178 seconds / chip
(20,200CPH) IPC9850 16,700CPH IC components * 3 1,850CPH 4,860CPH * 4
Component Mounting accuracy: Laser recognition: ± 0.05mm (Cpk ≧ 1)
Image recognition: ± 0.03mm (± 0.04mm when using MNVC (optional)
Component Mounting Type: Up to 80 (converted to 8mm) * 5
One multi-nozzle laser head (6 nozzles) plus one high resolution head (1 nozzle)
From 0402 (01005) to 74mm square components or 50×150mm
Vision centering system (featuring bottom, side, and back lighting, all ball recognition and split recognition)
1)Please ask for details on E size board.
2)When using MNVC. (option)
3)When using high-resolution camera. (option)
4)Effective tact: The IC placement speed indicates an estimated value obtained when the machine
places 36 QFP (100 pins or more) or BGA components (256 balls or more) on a M size board.
(CPH=number of components placed for one hour)
5)Estimated value when using MNVC (option) and picking up components simultaneous with all nozzles.
6)Including matrix tray changer, max 110.
Keywords:
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Contact: Demi
Phone: +86 13632571161
E-mail: demi@flason.com
Add: No.94,Guangtian Road,Songgang Street,Bao an District Shenzhen China